Our hardworking partners at IFSW have smashed it!!!

July 8, 2019

Along with two other partners, LASEA and BOSCH, the IFSW has reached another important milestone in the HIPERDIAS project by using a thin-disk multi-pass amplifier with an average output power of 1 kW on the processed workpiece and laser pulses with a duration of ~500 fs to generate structures with low roughness (Sa<1 µm) and high ablation rates (>1mm3/s) on silicon wafers. The laser system developed at the IFSW was integrated into a machine developed by the partner LASEA and used in cooperation with the partner BOSCH for the successful demonstration of the compatibility of precision and productivity of ablation of silicon at high average laser powers with ultrashort pulses. The processed material was not limited to silicon. Comparable surface structures were also achieved on copper, aluminium and stainless steel.



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This project has received funding from the European Union's Horizon 2020 Research and Innovation Programme under Grant Agreement No. 687880