Have a look at what one of our Partners, E6 have done in the HIPERDIAS Project - Diamond Ablation

December 12, 2019

This video shows laser ablation trials carried out on PCD wafer with a high-power femtosecond laser system (990 W on the workpiece with a minimum pulse duration of 500 fs). The laser was developed by USTUTT, with these experiments taking place at USTUTT. The aim of these trials is to reduce the roughness of the top surface of the PCD wafers to the lowest possible, anticipating 5 time reduction in processing time compared to current methods.

 

 

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This project has received funding from the European Union's Horizon 2020 Research and Innovation Programme under Grant Agreement No. 687880